Sony’s PS5, PS5 Pro and PS Portal Get Price Hikes Across Southeast Asia; No Price Increase in India Yet

Sony has announced the latest round of price hikes for PlayStation 5 consoles and accessories in Southeast Asia. The move follows similar increases in North America, Europe, and Japan announced by the Japanese tech conglomerate earlier this month. As per Sony, the price hike affects the PS5, PS5 Pro, and other latest-generation gaming consoles, with continued global e...

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Sony’s PS5, PS5 Pro and PS Portal Get Price Hikes Across Southeast Asia; No Price Increase in India Yet

Apple Said to Plan Launch of Foldable iPad, AI Smart Home Devices, Touchscreen MacBook Under John Ternus

Apple’s incoming Chief Executive Officer (CEO), John Ternus, is said to take the reins of the Cupertino-based tech giant on September 1. In the latest edition of his ‘Power On’ newsletter, Bloomberg’s Mark Gurman writes that Tim Cook will be leaving Ternus with a strong product lineup, with multiple devices either in the development phase or awaiting launch. M...

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Alien: Isolation 2 Gets Atmospheric Teaser From Creative Assembly and Sega

Developer Creative Assembly and Sega have finally shared a teaser for Alien: Isolation 2. The brief teaser doesn't give away any details, but features the phone booth save station from Alien: Isolation. The sequel was confirmed to be in early development in 2024.

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Xiaomi 17T With Dimensity 8500 Chip, 12GB of RAM Surfaces on Geekbench Ahead of Launch

Xiaomi is said to be preparing to expand its smartphone lineup with new sub-flagship models, following the launch of the flagship Xiaomi 17 series in India and the global markets earlier this year. The upcoming lineup is expected to include two handsets — Xiaomi 17T and Xiaomi 17T Pro. While the company has yet to confirm the smartphones, the vanilla model has now s...

Continue ReadingXiaomi 17T With Dimensity 8500 Chip, 12GB of RAM Surfaces on Geekbench Ahead of Launch

MediaTek Dimensity 7450 Chipset Unveiled Alongside Foldable-Ready Dimensity 7450X SoC

MediaTek has released the Dimensity 7450 and Dimensity 7450X chipsets. They are octa-core processors with a CPU configuration of four Arm Cortex-A78 cores clocked up to 2.6GHz. They support Wi-Fi 6E and Bluetooth 5.4. The Dimensity 7450X is optimised for foldable phones. They feature MediaTek’s 6th-generation NPU and include MediaTek HyperEngine for improved gaming ...

Continue ReadingMediaTek Dimensity 7450 Chipset Unveiled Alongside Foldable-Ready Dimensity 7450X SoC